So you have a block which the EUV 3d photomask frame line that goes round and layers in the design from the inside out of a 3D Hexagon block about 3cm^2. Contained in this are many micro hexagonal cylinders which can be photon electronic cells for a thermo optic pin. When the device is finished with the micro modular technology of the the circuit scaffolding then you can recycle the pins and upgrade where necessary which is cheaper than doing the whole thing each time. the material encasing device can also be recycled by putting a charge through the material at a certain frequency breaking the micro particle bonds ready for re-bonding.
This would be a very green and efficient way to make electronics in the future.